SMD reflow ovenSEHO
goreflow 1,8
SMD reflow oven
SEHO
goreflow 1,8
Year of construction
2011
Condition
Used
Location
Veenendaal 

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Machine data
- Machine type:
- SMD reflow oven
- Manufacturer:
- SEHO
- Model:
- goreflow 1,8
- Year of construction:
- 2011
- Condition:
- good (used)
Price & Location
- Location:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

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Details about the offer
- Listing ID:
- A21298657
- Update:
- 23.02.2026
Description
Type: Reflow soldering oven for PCB assembly (convection reflow).
Manufacturer: SEHO Systems GmbH.
Model: GoReflow 1.8.
Application: Soldering process using full convection heat for small to medium-sized batches.
Heating and Process Zones
Number of heating zones: 5 zones (via convection).
Length of heated zone: approx. 1850 mm.
Maximum PCB width: approx. 410 mm.
Number of cooling zones: 2 zones with active ventilation.
Average transport/conveyor speed: approx. 0.40 – 0.55 m/min.
Machine Structure and Dimensions
Total length: approx. 3200 mm.
Lodeyl Utbopfx Ak Doaa
Width: approx. 1250 mm.
Height: approx. 1600 mm.
Control and Functions
Operation: Touch display or microprocessor-controlled interface (depending on configuration).
Flux management: Filter and collection system for solder flux residues.
Safety features: Emergency stop button and visual status indicators (signal lamp).
Inline integration: Options for connection to SMT production lines via interfaces (optional).
The listing was translated automatically. Translation errors are possible.
Manufacturer: SEHO Systems GmbH.
Model: GoReflow 1.8.
Application: Soldering process using full convection heat for small to medium-sized batches.
Heating and Process Zones
Number of heating zones: 5 zones (via convection).
Length of heated zone: approx. 1850 mm.
Maximum PCB width: approx. 410 mm.
Number of cooling zones: 2 zones with active ventilation.
Average transport/conveyor speed: approx. 0.40 – 0.55 m/min.
Machine Structure and Dimensions
Total length: approx. 3200 mm.
Lodeyl Utbopfx Ak Doaa
Width: approx. 1250 mm.
Height: approx. 1600 mm.
Control and Functions
Operation: Touch display or microprocessor-controlled interface (depending on configuration).
Flux management: Filter and collection system for solder flux residues.
Safety features: Emergency stop button and visual status indicators (signal lamp).
Inline integration: Options for connection to SMT production lines via interfaces (optional).
The listing was translated automatically. Translation errors are possible.
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