2017 Cleveland G-APU 5Cleveland
G-APU 5
2017 Cleveland G-APU 5
Cleveland
G-APU 5
Year of construction
2017
Condition
Used
Location
Cloppenburg 

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Machine data
- Machine type:
- 2017 Cleveland G-APU 5
- Manufacturer:
- Cleveland
- Model:
- G-APU 5
- Year of construction:
- 2017
- Condition:
- used
Price & Location
- Location:
- Cloppenburg, Germany

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Details about the offer
- Listing ID:
- A21824433
- Reference number:
- M02291
- Update:
- 30.04.2026
Description
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels.
Accessories:
Total enclosure,
Camera system with 7x motorized zoom video system, plus 10x digital zoom
Extraction system 4000/3 D 240 3kW 630 m³/h
Crodpfxey Ia Svj Anwsb
Swivel unit for package dressing
Grinding spindle SK 40
Grinding wheel guard, swivels to the rear
Software for converting DXF files to CNC files on PC
Single-disc width: 30 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
colour: Grey
weight: 1900 kg
Diamond- / CBN grinding wheel diameter: 400 mm
Accessories:
Total enclosure,
Camera system with 7x motorized zoom video system, plus 10x digital zoom
Extraction system 4000/3 D 240 3kW 630 m³/h
Crodpfxey Ia Svj Anwsb
Swivel unit for package dressing
Grinding spindle SK 40
Grinding wheel guard, swivels to the rear
Software for converting DXF files to CNC files on PC
Single-disc width: 30 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
colour: Grey
weight: 1900 kg
Diamond- / CBN grinding wheel diameter: 400 mm
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